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Orienting parts that measure only a few micrometers in diameter introduces several challenges that need not be considered at the macro‐scale. First, there are several kinds of sticking effects due to Van der Waals forces and static electricity, which complicate hand‐off motions and release of a part. Second, the degrees of freedom of micro‐manipulators are limited. This paper proposes a pair of manipulation primitives and a complete algorithm that addresses these challenges. We will show that a sequence of these two manipulation primitives can uniquely orient any asymmetric part while maintaining contact without sensing. This allows us to apply the same plan to many (identical) parts simultaneously. For asymmetric parts we can find a plan of length O(n) in O(n) time that orients the part, where n is the number of vertices.

National Engineers' Week takes place annually during the week of George Washington's birthday. Washington, best known as a soldier and stateman, was also a surveyor and road builder. The National Society of Professional Engineers began this tradition in 1950 with a two‐page article in The American Engineer. The society promoted Engineers Week on a national level beginning in 1951. February and March issues of The American Engineer in 1951 discussed the early celebrations of this week. The society's history (Robbins) also gives insights about the creation of this special week. Although the National Society of Professional Engineers initiated this week, other engineering organizations became involved later. At the present time, many organizations participate in the celebration. Each year, the National Society of Professional Engineers plans a particular theme for the week.

The purpose of this paper is to characterize the motivations used into migrating to lead‐free solder by providing examples and directions for those making the material change.

This work achieves its objective of identifying which electronic industry actions towards lead‐free soldering have been successful and why. The research reported the various motivating factors considered in adopting lead‐free electronics. To that end, the authors researched industry literature and discussed approaches with various companies and agencies. The scope of this paper is largely the board‐component level soldering process and companies involved in the international electronics industry.

The motivation to migrate to lead‐free solder has been and continues to be multi‐faceted. Issues include regulatory, commercial, and technical. Processing with lead‐free solder is successful, so the electronics industry's move towards environmentally compatible processes will meet regulated dates for change.

A company can learn how to incorporate environmental improvement principles resulting from the migration to lead‐free solder. Using that migration as a case study, the company can realize additional benefits by applying these principles to other product lines. Those interested in developing environmentally friendly products and processes can adopt the lessons that this paper identifies. Incorporation of lead‐free techniques, rather than resistance to change, is the result of adopting the lessons.

The paper presents a synopsis of the electronic industry's migration to lead‐free products and processes. It compares motivations for change that other studies have not compared. Manufacturers searching for direction and example to meet waste minimization goals will find the paper useful in providing such.

The purpose of this paper is to investigate the electronic industry's reaction to environmental regulations specifically in terms of lead‐free solders and halogen‐free flame‐retardants (FRs).

This work achieves its objective by discussing the various international regulations pertaining to electronics manufacturing and relating the industry reactions to those regulations. The electronics industry is pursuing lead‐free solders and halogen‐free FRs, in part due to regulations. However, the paper includes examples of how the industry is successful in implementing environmentally friendly changes.

The authors compared regulations from Japan, the European Union, and the US. While the regulations themselves vary in scope, industry actions to find alternatives do have common purposes. Electronics manufacturers recognize that environmentally motivated changes are beneficial in terms of waste minimization. Regardless of the regulatory motivation, minimization does lead to energy and economic efficiency.

Electronics manufacturers that are interested in green design will benefit from understanding present regulations. They will also benefit from the included examples of product and process improvement for the purpose of environmental compatibility. The paper includes specific examples of material alternatives to banned substances.

This paper derives its perspective from a similar review of literature and company findings that the authors completed in 2001. As refinement of the regulations has continued, the electronics industry has developed improvements in basic materials and processes.

For one merit-based undergraduate scholarship program at Washington University in St. Louis (the University), discovery and dialogue have been essential to the program’s nearly 30-year existence. Named for Dr. John B. Ervin, the first African American Dean at Washington University in St. Louis, the John B. Ervin Scholars Program has attracted, recruited, retained, and graduated over 600 students deemed to exemplify extraordinary commitments to four pillars – scholarship, leadership, service, and diversity. Because the Program’s administrators have cultivated a community grounded in discovery and dialogue, the Ervin Scholars’ resolve to foster a more just and equitable society has deepened over time, perhaps preparing them for this time in which universities, this nation, and our world face crises over race. This resolve has manifested the last few years as Ervin Scholars have responded quickly to racial issues at Washington University in St. Louis and throughout the nation.

With its 30-year foundation, the John B. Ervin Scholars Program continues to develop, nurture, and support young people who advance discovery and dialogue. Drawing on a number of interviews, Program and University publications, and external publications, “A Legacy of Commitment,” the second installment of the Program’s history, demonstrates how the presence, contributions, and achievements of Ervin Scholars have changed Washington University in St. Louis. The Ervin Program has been an important part of the University’s efforts to be more diverse and inclusive, and it will continue to be integral to the University’s current and future plans.

This paper seeks to investigate the electronics industry's reaction to environmental regulations specifically in terms of lead‐free solders and halogen‐free flame‐retardants (FRs).

This work achieves its objective by discussing the various international environmental regulations pertaining to electronics manufacturing and relating the industry reactions to those regulations. It also provides the market trends related to lead‐ and halogen‐free products. The electronics industry is pursuing lead‐free solders and halogen‐free FRs, in part due to regulations. However, the paper includes examples of how the industry is successful in implementing environmentally friendly changes.

The authors compared regulations from Japan, the European Union, the USA, and China. While the regulations themselves vary in scope, industry actions to find alternatives do have common purposes. Electronics manufacturers recognize that environmentally motivated changes are beneficial in terms of waste minimization.

Electronics manufacturers that are interested in green design will benefit from understanding present regulations. They will also benefit from the included examples of product and process improvement for the purpose of environmental compatibility.

This paper derives its perspective from a similar review of literature and company findings that the authors completed in 2006. As refinement of the regulations has continued, the electronics industry has developed improvements in basic materials and processes.

The desirability of electronic document delivery systems has been argued for years and the reasons for the slow progress of the idea are discussed. An explanation of the technical background is provided followed by some examples of electronic means of information distribution such as facsimile and disc‐based systems. Some experimental projects are described and the article concludes with a description of document image processing systems used for business purposes which have a number of features in common with delivery systems.

Reviews recent interlending and document supply literature. Considers the implications of open access archiving and the ongoing developments in consortia and electronic journals. A number of other issues are reviewed briefly.